Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11640952 | Electronic component embedded substrate | Mi Sun Hwang, Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Jun Hyeong Jang +4 more | 2023-05-02 |
| 11631643 | Substrate embedded electronic component package | Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Je Sang Park, Mi Sun Hwang +2 more | 2023-04-18 |
| 11183462 | Substrate having electronic component embedded therein | Mi Sun Hwang, Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Jun Hyeong Jang +4 more | 2021-11-23 |
| 10779396 | Printed circuit board having embedded electronic device | Yong-duk Lee, Sang Ho Jeong | 2020-09-15 |