Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7258931 | Semiconductor wafers having asymmetric edge profiles that facilitate high yield processing by inhibiting particulate contamination | Gi Jung Kim, Woo-Serk Kim, Sang-Mun Chon | 2007-08-21 |
| 6919214 | Apparatus for analyzing a substrate employing a copper decoration | Gi Jung Kim, Kyoo-Chul Cho, Sook-Hyun Park | 2005-07-19 |
| 6724474 | Wafer surface inspection method | Kyoo-Chul Cho, Kyong-Rim Kang, Soo-yeul Choi | 2004-04-20 |
| 6552337 | Methods and systems for measuring microroughness of a substrate combining particle counter and atomic force microscope measurements | Kyoo-Chul Cho, Jeong Hoon An, Gi Jung Kim | 2003-04-22 |
| 6252228 | Method of analyzing morphology of bulk defect and surface defect on semiconductor wafer | Sung Hoon Cho | 2001-06-26 |
| 5972863 | Slurry compositions for polishing wafers used in integrated circuit devices and cleaning compositions for removing electron wax after polishing | Jung Min Park, Sung Hoon Cho, Gi Jung Kim | 1999-10-26 |