Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11926695 | High-thermal conductive epoxy compound and composition, material for semiconductor package, molded product, electric and electronic device, and semiconductor package including the same | Kyeong Pang, In Hwan Kim, Jonghoon WON, Mooho Lee, Hyejeong Lee | 2024-03-12 |
| 11827741 | Epoxy compound, composition prepared therefrom, semiconductor device prepared therefrom, electronic device prepared therefrom, article prepared therefrom, and method of preparing epoxy compound | Changho NOH, Insu Lee, Yoonseok Ko, Mijeong KIM, Keechang Lee +1 more | 2023-11-28 |