Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12404361 | Amine-based curing agents, and compositions, semiconductor packages, and electronic devices including the same | Insu Lee, In Hwan Kim, Kyeon Pang, Byung Seo, Changho NOH +1 more | 2025-09-02 |
| 11926695 | High-thermal conductive epoxy compound and composition, material for semiconductor package, molded product, electric and electronic device, and semiconductor package including the same | Kyeong Pang, In Hwan Kim, Jonghoon WON, Hyejeong Lee, Songwon Hyun | 2024-03-12 |
| 11421073 | Highly thermally conductive epoxy compound, and composition, material for semiconductor package, molded product, electric and electronic device and semiconductor package including the same | Jonghoon WON, In Hwan Kim, Kyeong Pang | 2022-08-23 |
| 10479889 | Thermoplastic resin composition, molded article made therefrom, and method of preparing the composition | Kyunghae Lee, Seungjoon Hwang, Namsoo Park, Jun Chwae | 2019-11-19 |
| 10160825 | Polyurethane elastomer, thermoplastic resin composition comprising the polyurethane elastomer, molded article made of the thermoplastic resin composition, and method of preparing the polyurethane elastomer | Inki Kim, Kyunghae Lee, Kwangmyung Cho | 2018-12-25 |
| 10160857 | Thermoplastic resin composition and molded article made therefrom | Chansu Kim, Kyunghae Lee, Jun Chwae, Kwangmyung Cho | 2018-12-25 |
| 9381498 | Method for preparing hydrogenation catalyst and method for preparing diols from lactones using the hydrogenation catalyst | Hyeonsu Heo, Jongmin Lee, Kyunghae Lee, Jun Chwae | 2016-07-05 |