Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6621164 | Chip size package having concave pattern in the bump pad area of redistribution patterns and method for manufacturing the same | Chan Hwang | 2003-09-16 |
| 6455408 | Method for manufacturing semiconductor devices having redistribution patterns with a concave pattern in a bump pad area | Chan Hwang | 2002-09-24 |