Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8993436 | Method for fabricating semiconductor device that includes forming passivation film along side wall of via hole | Dong-Whan Ko, Jong Sam Kim, Hong-Jae Shin, Sae-il Son, Woo Jin Jang | 2015-03-31 |
| 8518723 | Method of fabricating semiconductor integrated circuit device | Chong-Kwang Chang, Hong-Jae Shin, Nae-In Lee, Kwang-hyeon Baik, Hyo Jeong Kim | 2013-08-27 |