Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8993436 | Method for fabricating semiconductor device that includes forming passivation film along side wall of via hole | Jong Sam Kim, Hong-Jae Shin, Seung-Il Bok, Sae-il Son, Woo Jin Jang | 2015-03-31 |