Issued Patents All Time
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7053469 | Leadless semiconductor package and manufacturing method thereof | Kwang-Won Koh, Song Woon Kim | 2006-05-30 |
| 6984878 | Leadless leadframe with an improved die pad for mold locking | Yong-Gill Lee, Hyung Jun Park, Kyung-Soo Rho, Jin-Hee Won | 2006-01-10 |