Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7211467 | Method for fabricating leadless packages with mold locking characteristics | Sang Bae Park, Hyung Jun Park, Kyung-Soo Rho, Jin-Hee Won | 2007-05-01 |
| 7125747 | Process for manufacturing leadless semiconductor packages including an electrical test in a matrix of a leadless leadframe | Hyung Jun Park, Sang Bae Park | 2006-10-24 |
| 7087462 | Method for forming leadless semiconductor packages | Sang Bae Park, Hyung Jun Park, Chang Young Sohn | 2006-08-08 |
| 6984878 | Leadless leadframe with an improved die pad for mold locking | Sang Bae Park, Hyung Jun Park, Kyung-Soo Rho, Jin-Hee Won | 2006-01-10 |