MK

Moon-su Kim

Samsung: 11 patents #12,136 of 75,807Top 20%
HC Hyundai Mobis Co.: 2 patents #479 of 1,496Top 35%
SH Sk Hynix: 1 patents #3,115 of 4,849Top 65%
Overall (All Time): #336,675 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11861281 Computer-implemented method and computing system for designing integrated circuit by considering timing delay Jong Pil Lee, Bong-il Park, Sun-ik Heo 2024-01-02
11475195 Computer-implemented method and computing system for designing integrated circuit by considering timing delay Jong Pil Lee, Bong-il Park, Sun-ik Heo 2022-10-18
11256846 System and method of analyzing integrated circuit in consideration of a process variation and a shift Naya Ha, Jong-Ku Kang, Andrew Paul Hoover 2022-02-22
10924046 Motor driven power steering apparatus and control method therefor Ji Hoon Yoo 2021-02-16
10902168 Computer-implemented method and computing system for designing integrated circuit by considering timing delay Jong Pil Lee, Bong-il Park, Sun-ik Heo 2021-01-26
10796050 Method for generating aging model and manufacturing semiconductor chip using the same 2020-10-06
10740522 Apparatus and method of operating timing analysis considering multi-input switching 2020-08-11
10546093 Computer-implemented method and computing system for designing integrated circuit by considering process variations of wire 2020-01-28
10414431 Control apparatus and method of motor driven power steering system Ji Hoon Yoo 2019-09-17
10372869 System and method of analyzing integrated circuit in consideration of a process variation Naya Ha, Jong-Ku Kang, Andrew Paul Hoover 2019-08-06
10192015 Method of estimating a yield of an integrated circuit and method of optimizing a design for an integrated circuit Kyoung-Hwan Lim, Cheol-Jun Bae 2019-01-29
9977845 Method of performing static timing analysis for an integrated circuit 2018-05-22
9253228 Cloud computing method, computing apparatus and server using the same Dae-Hyun Lee, Chun-un Kang, Jeong-Gon Kim 2016-02-02
7796395 Heat dissipation device for semiconductor package module, and semiconductor package module having the same 2010-09-14