Issued Patents All Time
Showing 76–100 of 102 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7785864 | Bio-molecules detecting apparatus using electromagnetic induction and detecting method using the same | Jung-ho Kang, Sung-hee Lee, Young Il Kim, Tae-sik Park | 2010-08-31 |
| 7764070 | Bio molecular detection apparatus and method thereof | Tae-sik Park, Jung-ho Kang, Jong-hwa Won, Young Il Kim | 2010-07-27 |
| 7758168 | Inkjet printhead and method of manufacturing the same | Dong-sik Shim, Hyung Choi, Yong-seop Yoon | 2010-07-20 |
| 7755151 | Wafer level package for surface acoustic wave device and fabrication method thereof | Ji-hyuk Lim, Jun Sik Hwang, Woon-bae Kim, Suk Jin Ham, Jong-oh Kwon +1 more | 2010-07-13 |
| 7741105 | Biomolecule chip and fabrication method thereof | Young Il Kim, Jung-ho Kang, Tae-sik Park | 2010-06-22 |
| 7579685 | Wafer level packaging cap and fabrication method thereof | Woon-bae Kim, Kae-dong Back, Qian Wang, Jun Sik Hwang, Kyu-dong Jung | 2009-08-25 |
| 7545017 | Wafer level package for surface acoustic wave device and fabrication method thereof | Jun Sik Hwang, Ji-hyuk Lim, Woon-bae Kim | 2009-06-09 |
| 7528689 | Vibration type MEMS switch and fabricating method thereof | Tae-sik Park, Hee-moon Jeong | 2009-05-05 |
| 7510968 | Cap for semiconductor device package, and manufacturing method thereof | Jong-oh Kwon, Kae-dong Back, Qian Wang, Jun Sik Hwang, Kyu-dong Jung | 2009-03-31 |
| 7452809 | Fabrication method of packaging substrate and packaging method using the packaging substrate | Woon-bae Kim, Jun Sik Hwang, Chang-youl Moon | 2008-11-18 |
| 7449366 | Wafer level packaging cap and fabrication method thereof | Jong-oh Kwon, Woon-bae Kim, Ji-hyuk Lim, Suk Jin Ham, Jun Sik Hwang +1 more | 2008-11-11 |
| 7432781 | Monolithic duplexer and fabrication method thereof | Sang Chul Sul, Duck Hwan Kim, Chul Soo Kim, In-sang Song, Kyu-dong Jung +1 more | 2008-10-07 |
| 7417525 | High efficiency inductor, method for manufacturing the inductor, and packaging structure using the inductor | Jong-oh Kwon, Woon-bae Kim, Jun Sik Hwang, Chang-youl Moon, In-sang Song | 2008-08-26 |
| 7411261 | MEMS device and fabrication method thereof | Eun Sung Lee, Chung-woo Kim, In-sang Song, Jong Seok Kim | 2008-08-12 |
| 7408257 | Packaging chip and packaging method thereof | Kyu-dong Jung, Woon-bae Kim, In-sang Song, Jun Sik Hwang, Suk Jin Ham | 2008-08-05 |
| 7408434 | Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package | Jong-oh Kwon, Woon-bae Kim, Jea Shik Shin, Jun Sik Hwang, Eun Sung Lee | 2008-08-05 |
| 7335974 | Multi stack packaging chip and method of manufacturing the same | Jun Sik Hwang, Woon-bae Kim, Chang-youl Moon, Kyu-dong Jung | 2008-02-26 |
| 7263883 | Gyro-sensor comprising a plurality of component units, and fabricating method thereof | Tae-sik Park, Chang-youl Moon | 2007-09-04 |
| 7225524 | Method for fabricating a gyroscope | Hyung Choi, Seok Jin Kang | 2007-06-05 |
| 7172916 | Method and apparatus for vacuum-mounting a micro electro mechanical system on a substrate | Kyu-dong Jung, Chan-bong Jun, Hyung Choi, Seok Jin Kang, Seog-woo Hong +2 more | 2007-02-06 |
| 7169684 | Device having inductors and capacitors and a fabrication method thereof | In-sang Song, Young Tack Hong, Sung-hye Jeong, Jeong-yoo Hong | 2007-01-30 |
| 7122942 | Electrostatic RF MEMS switches | In-sang Song, Young Il Kim, Dong-ha Shim, Young Tack Hong, Sun-Hee Park +1 more | 2006-10-17 |
| 7084073 | Method of forming a via hole through a glass wafer | Hyung Choi, Kyu-dong Jung, Mi Jang, Seog-woo Hong, Seok-whan Chung +2 more | 2006-08-01 |
| 6975010 | MEMS structure having a blocked-sacrificial layer support/anchor and a fabrication method of the same | Eun Sung Lee, Hyun Ok Kim | 2005-12-13 |
| 6952965 | Vertical MEMS gyroscope by horizontal driving | Seok Jin Kang, Seok-whan Chung, Kyu-dong Jung, Seog-soo Hong | 2005-10-11 |