Issued Patents All Time
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7279412 | Parallel multi-layer printed circuit board having improved interconnection and method for manufacturing the same | Byung-Kook Sun, Chang-Kyu Song, Geum Hee Yun, Tae Hoon Kim | 2007-10-09 |
| 7169707 | Method of manufacturing package substrate with fine circuit pattern using anodic oxidation | Duck Young Maeng, Byung-Kook Sun, Tae Hoon Kim, Jong-Suk Bae, Yoong Oh +2 more | 2007-01-30 |