Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8872354 | Method of forming through silicon via of semiconductor device using low-K dielectric material | Sang-Hoon Ahn, Jang-Hee Lee, Jong-min Beak, Kyoung-Hee Kim, Byung-Lyul Park +1 more | 2014-10-28 |