Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7481351 | Wire bonding apparatus and method for clamping a wire | Tae Hyun Kim, Youn Sung Ko, Young-Kyun Sun, Dae-Soo Kim, Kook-Jin Oh +1 more | 2009-01-27 |
| 6578567 | Wafer sawing apparatus | Joung-Min Oh, Sung-hee Lee, Byeong-Soo Kim | 2003-06-17 |