Issued Patents All Time
Showing 51–64 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8315056 | Heat-radiating substrate and method of manufacturing the same | Jung Eun Kang, Seog Moon Choi, Kwang Soo Kim, Sung Keun Park | 2012-11-20 |
| 8310023 | Light emitting diode package and fabrication method thereof | Ho Joon Park, Woong Hwang, Seog Moon Choi, Sung Jun Lee, Sang Hyun Choi | 2012-11-13 |
| 8242371 | Heat dissipating circuit board and method of manufacturing the same | Hye Sook Shin, Seog Moon Choi, Shan Gao, Tae Hyun Kim, Young Ki Lee | 2012-08-14 |
| 8220826 | Ramp bracket for curtain airbag of vehicle | Sung Yong Park, Chang Jin Oh, Dae Young Kwak, Woo Hyun Lim, Tae Woo Kim +2 more | 2012-07-17 |
| 8198543 | Rigid-flexible circuit board and method of manufacturing the same | Jung Eun Kang, Seog Moon Choi, Tae Hoon Kim, Young Ki Lee, Hye Sook Shin | 2012-06-12 |
| 7992894 | Side airbag unit for vehicles | Dae Young Kwak, Tae Ik Kwon, Soon Bok Lee, Anders Palo | 2011-08-09 |
| 7971900 | Side airbag apparatus for vehicles | Dae Young Kwak, Tae Ik Kwon, Soon Bok Lee, Anders Palo | 2011-07-05 |
| 7816156 | Light emitting diode package and fabrication method thereof | Sang Hyun Choi, Woong Hwang, Seog Moon Choi, Ho Joon Park, Sung Jun Lee | 2010-10-19 |
| 7649208 | Light emitting diode package including monitoring photodiode | Sung Jun Lee, Woong Hwang, Seog Moon Choi, Ho Joon Park, Sang Hyun Choi | 2010-01-19 |
| 7597350 | Curtain airbag for vehicle | — | 2009-10-06 |
| 7582496 | LED package using Si substrate and fabricating method thereof | Sung Jun Lee, Woong Hwang, Sang Hyun Choi, Ho Joon Park, Seog Moon Choi | 2009-09-01 |
| 7326964 | Light emitting diode package with protective function against electrostatic discharge | Woong Hwang, Seog Moon Choi, Ho Joon Park, Sung Jun Lee, Sang Hyun Choi | 2008-02-05 |
| 7262440 | Light emitting diode package and fabrication method thereof | Sang Hyun Choi, Woong Hwang, Seog Moon Choi, Ho Joon Park, Sung Jun Lee | 2007-08-28 |
| 6068316 | Large diameter wafer conveying system and method thereof | Dae-Woo Kim, Sang-Kook Choi, Jong-Dae Park | 2000-05-30 |