Issued Patents All Time
Showing 26–50 of 112 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8710641 | Combination for composite layered chip package | Yoshitaka Sasaki, Hiroyuki Ito | 2014-04-29 |
| 8659166 | Memory device, laminated semiconductor substrate and method of manufacturing the same | Yoshitaka Sasaki, Hiroyuki Ito | 2014-02-25 |
| 8652877 | Method of manufacturing layered chip package | Yoshitaka Sasaki, Hiroyuki Ito, Hiroshi Ikejima | 2014-02-18 |
| 8653639 | Layered chip package and method of manufacturing same | Yoshitaka Sasaki, Hiroyuki Ito, Hiroshi Ikejima | 2014-02-18 |
| 8618646 | Layered chip package and method of manufacturing same | Yoshitaka Sasaki, Hiroyuki Ito, Hiroshi Ikejima | 2013-12-31 |
| 8587125 | Method of manufacturing layered chip package | Yoshitaka Sasaki, Hiroyuki Ito | 2013-11-19 |
| 8576514 | Thin-film magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive | Yoshitaka Sasaki, Hiroyuki Ito, Shigeki Tanemura, Kazuki Sato | 2013-11-05 |
| 8569878 | Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same | Yoshitaka Sasaki, Hiroyuki Ito | 2013-10-29 |
| 8552534 | Laminated semiconductor substrate, semiconductor substrate, laminated chip package and method of manufacturing the same | Yoshitaka Sasaki, Hiroyuki Ito, Shigeki Tanemura, Kazuki Sato | 2013-10-08 |
| 8541887 | Layered chip package and method of manufacturing same | Yoshitaka Sasaki, Hiroyuki Ito, Hiroshi Ikejima | 2013-09-24 |
| 8536712 | Memory device and method of manufacturing the same | Yoshitaka Sasaki, Hiroyuki Ito | 2013-09-17 |
| 8525167 | Laminated chips package, semiconductor substrate and method of manufacturing the laminated chips package | Yoshitaka Sasaki, Hiroyuki Ito | 2013-09-03 |
| 8514516 | Thin-film magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive | Yoshitaka Sasaki, Hiroyuki Ito, Hironori Araki, Shigeki Tanemura, Kazuki Sato | 2013-08-20 |
| 8514520 | Perpendicular magnetic recording head including a front shield part and the method of manufacturing the same | Yoshitaka Sasaki, Hiroyuki Ito, Shigeki Tanemura, Kazuki Sato | 2013-08-20 |
| 8499435 | Method of manufacturing a thin-film magnetic head | Yoshitaka Sasaki, Hiroyuki Ito, Shigeki Tanemura, Kazuki Sato | 2013-08-06 |
| 8498080 | Magnetic head for perpendicular magnetic recording that includes a sensor for detecting contact with a recording medium | Yoshitaka Sasaki, Hiroyuki Ito, Kazuki Sato | 2013-07-30 |
| 8493687 | Magnetic head for perpendicular magnetic recording with shield around main pole | Yoshitaka Sasaki, Hiroyuki Ito, Kazuki Sato | 2013-07-23 |
| 8482105 | Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same | Yoshitaka Sasaki, Hiroyuki Ito | 2013-07-09 |
| 8477452 | Magnetic head for perpendicular magnetic recording having a tapered main pole | Yoshitaka Sasaki, Hiroyuki Ito, Kazuki Sato, Shigeki Tanemura, Hironori Araki | 2013-07-02 |
| 8466562 | Layered chip package | Yoshitaka Sasaki, Hiroyuki Ito, Hiroshi Ikejima | 2013-06-18 |
| 8462482 | Ceramic capacitor and method of manufacturing same | Yoshitaka Sasaki, Hiroshi Ikejima | 2013-06-11 |
| 8455349 | Layered chip package and method of manufacturing same | Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada | 2013-06-04 |
| 8441755 | Magnetic head for perpendicular magnetic recording having a main pole, a shield and a coil core part setback away from the medium facing surface a specified distance | Yoshitaka Sasaki, Hiroyuki Ito, Kazuki Sato | 2013-05-14 |
| 8441112 | Method of manufacturing layered chip package | Yoshitaka Sasaki, Hiroyuki Ito, Hiroshi Ikejima | 2013-05-14 |
| 8432662 | Ceramic capacitor and method of manufacturing same | Yoshitaka Sasaki, Hiroshi Ikejima | 2013-04-30 |