| 9952041 |
Assessing alignment of top and bottom ends of TSVs and characterizing microfabrication process |
Rajiv Roy, David L. Grant, Hanh Chu |
2018-04-24 |
| 9714825 |
Wafer shape thickness and trench measurement |
David L. Grant |
2017-07-25 |
| 9587932 |
System for directly measuring the depth of a high aspect ratio etched feature on a wafer |
David L. Grant |
2017-03-07 |
| 8649016 |
System for directly measuring the depth of a high aspect ratio etched feature on a wafer |
David L. Grant |
2014-02-11 |
| 7738113 |
Wafer measurement system and apparatus |
David L. Grant, Michael A. Mahoney, Tsan Y. Chan |
2010-06-15 |
| 7477401 |
Trench measurement system employing a chromatic confocal height sensor and a microscope |
David L. Grant |
2009-01-13 |
| 6782146 |
Multiple polarization combiner-splitter-isolator and method of manufacturing the same |
Scott M. Hellman, Bryan Paolini, Paul A. Townley-Smith, Michael Ushinsky |
2004-08-24 |
| 6710864 |
Concentricity measuring instrument for a fiberoptic cable end |
David L. Grant |
2004-03-23 |