Issued Patents All Time
Showing 51–60 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7662713 | Semiconductor device production method that includes forming a gold interconnection layer | Hitoshi Tamura | 2010-02-16 |
| 7372163 | Semiconductor device and production method therefor | — | 2008-05-13 |
| 7335989 | Semiconductor device and production method therefor | Hitoshi Tamura | 2008-02-26 |
| 7244635 | Semiconductor device and method of manufacturing the same | — | 2007-07-17 |
| 7151312 | Semiconductor device and method of manufacturing the same | — | 2006-12-19 |
| 7045900 | Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device | Junichi Hikita, Nobuhisa Kumamoto, Katsumi Sameshima, Kazutaka Shibata, Shigeyuki Ueda | 2006-05-16 |
| 6847117 | Semiconductor device including a passivation film to cover directly an interface of a bump and an intermediated layer | — | 2005-01-25 |
| 6794732 | Semiconductor device and method of manufacturing the same | — | 2004-09-21 |
| 6724084 | Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device | Junichi Hikita, Nobuhisa Kumamoto, Katsumi Sameshima, Kazutaka Shibata, Shigeyuki Ueda | 2004-04-20 |
| 6462420 | Semiconductor chip and semiconductor device having a chip-on-chip structure | Junichi Hikita, Hiroo Mochida, Kazutaka Shibata | 2002-10-08 |