Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6405429 | Microbeam assembly and associated method for integrated circuit interconnection to substrates | John W. Slemmons, Jay Messner, Frank Woolston, Patrick Redmond, William R. Fewer | 2002-06-18 |
| 6297069 | Method for supporting during fabrication mechanical members of semi-conductive dies, wafers, and devices and an associated intermediate device assembly | William R. Fewer | 2001-10-02 |
| 5440239 | Transferable solder bumps for interconnect and assembly of MCM substrates | William R. Fewer | 1995-08-08 |
| 5214261 | Method and apparatus for dicing semiconductor substrates using an excimer laser beam | — | 1993-05-25 |
| 5151389 | Method for dicing semiconductor substrates using an excimer laser beam | — | 1992-09-29 |
| 5091288 | Method of forming detector array contact bumps for improved lift off of excess metal | Angel Pepe, William R. Fewer, Eugene J. Babcock | 1992-02-25 |