YU

Yoshinori Ueda

Ricoh Company: 14 patents #1,578 of 9,818Top 20%
NK Nihon Kohden: 13 patents #24 of 467Top 6%
MC Murata Manufacturing Co.: 6 patents #1,272 of 5,295Top 25%
HI Hitachi: 5 patents #7,555 of 28,497Top 30%
SC Sumitomo Seika Chemicals Co.: 2 patents #132 of 365Top 40%
OK Okuma: 1 patents #106 of 233Top 50%
JI Japan Nuclear Cycle Development Institute: 1 patents #36 of 122Top 30%
DC Daiichi Kasei Co.: 1 patents #8 of 24Top 35%
📍 Kasai, JP: #103 of 5,842 inventorsTop 2%
Overall (All Time): #70,265 of 4,157,543Top 2%
43
Patents All Time

Issued Patents All Time

Showing 26–43 of 43 patents

Patent #TitleCo-InventorsDate
8212282 Semiconductor device used in step-up DC-DC converter, and step-up DC-DC converter Masaya Ohtsuka 2012-07-03
7842967 Semiconductor device used in step-up DC-DC converter, and step-up DC-DC converter Masaya Ohtsuka 2010-11-30
7208359 Method of forming semiconductor integrated device Naohiro Ueda 2007-04-24
7169216 Electroless copper plating solution, electroless copper plating process and production process of circuit board Takeyuki Itabashi, Hiroshi Kanemoto, Haruo Akahoshi, Eiji Takai, Naoki Nishimura +1 more 2007-01-30
7151038 Semiconductor device having an integral resistance element 2006-12-19
6989329 Method of manufacturing a wiring substrate and an electroless copper plating solution for providing interlayer connections Takeyuki Itabashi, Haruo Akahoshi, Eiji Takai, Naoki Nishimura, Tadashi Iida 2006-01-24
6937001 Circuit for generating a reference voltage having low temperature dependency 2005-08-30
6917081 Semiconductor integrated device Naohiro Ueda 2005-07-12
6900394 Electroless copper plating machine, and multi-layer printed wiring board Takeyuki Itabashi, Haruo Akahoshi, Tadashi Iida, Eiji Takai, Naoki Nishimura 2005-05-31
6894365 Semiconductor device having an integral resistance element 2005-05-17
6831009 Wiring substrate and an electroless copper plating solution for providing interlayer connections Takeyuki Itabashi, Haruo Akahoshi, Eiji Takai, Naoki Nishimura, Tadashi Iida 2004-12-14
6805915 Electroless copper plating solution, electroless copper plating process and production process of circuit board Takeyuki Itabashi, Hiroshi Kanemoto, Haruo Akahoshi, Eiji Takai, Naoki Nishimura +1 more 2004-10-19
6798278 Voltage reference generation circuit and power source incorporating such circuit 2004-09-28
6552603 Voltage reference generation circuit and power source incorporating such circuit 2003-04-22
6336085 Simulation method of extraction system Miyuki Igarashi 2002-01-01
6333047 Molded capsule superior in strength and stability and method for preparing same Hiroshi Katagihara, Yohichi Kinekawa, Yukiko Yonemoto, Satoshi Sogawa, Naofumi Kitabatake 2001-12-25
5269872 Identity tag attaching apparatus for wiring cable 1993-12-14
5031019 Method for manufacturing a semiconductor device having isolated islands and its resulting structure Daisuke Kosaka, Tetsuo Hikawa, Masami Nishikawa 1991-07-09