Issued Patents All Time
Showing 51–75 of 207 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9234746 | Inspection method and inspection apparatus of winding state of sheet member | Hiroki Inoue, Nobuhiro Tani, Toshihide Suzuki | 2016-01-12 |
| 9232642 | Wiring substrate, method for manufacturing the wiring substrate, and semiconductor package | Junichi Nakamura, Michiro Ogawa, Hiromi Denda | 2016-01-05 |
| 9215812 | Support body, method of manufacturing support body, method of manufacturing wiring board, method of manufacturing electronic component, and wiring structure | — | 2015-12-15 |
| 9210808 | Wiring substrate and method of manufacturing the same | Kentaro Kaneko, Toshimitsu Omiya, Kotaro Kodani, Junichi Nakamura | 2015-12-08 |
| 9137896 | Wiring substrate | Kotaro Kodani, Junichi Nakamura, Kentaro Kaneko | 2015-09-15 |
| 9116487 | Image forming apparatus | Akihiko Tosaka, Toshiyuki Uchida, Hiroaki Murakami | 2015-08-25 |
| 9102116 | Sheet creaser, sheet finisher, image forming apparatus, sheet folding method, and computer program product | Nobuyoshi Suzuki, Masahiro Tamura, Shuuya Nagasako, Naohiro Kikkawa, Tomohiro Furuhashi +8 more | 2015-08-11 |
| 9089041 | Method of fabricating a wiring board | Kotaro Kodani, Kentaro Kaneko | 2015-07-21 |
| 9058740 | State determining device, image processing apparatus, state determining method, and computer program product | Takashi Kuwayama, Yuki Sato, Tetsuji Nishikawa, Nobuhiro Shima, Jo Ebara | 2015-06-16 |
| 9024207 | Method of manufacturing a wiring board having pads highly resistant to peeling | Michiro Ogawa, Kentaro Kaneko | 2015-05-05 |
| 9006103 | Method of manufacturing wiring substrate | Kotaro Kodani, Junichi Nakamura, Kentaro Kaneko | 2015-04-14 |
| 8903278 | Drive unit, and image forming apparatus and process cartridge incorporating same | Hiroaki Murakami, Toshiyuki Uchida, Akihiko Tosaka | 2014-12-02 |
| 8888235 | Liquid ejecting apparatus | — | 2014-11-18 |
| 8810040 | Wiring substrate including projecting part having electrode pad formed thereon | Kentaro Kaneko | 2014-08-19 |
| 8794116 | Perforating apparatus, sheet processing apparatus, and image forming apparatus | Masahiro Tamura, Nobuyoshi Suzuki, Shuuya Nagasako, Tomoichi Nomura, Hiroshi Maeda +2 more | 2014-08-05 |
| 8797757 | Wiring substrate and manufacturing method thereof | Kentaro Kaneko, Toshiaki Aoki, Kotaro Kodani, Junichi Nakamura | 2014-08-05 |
| 8688006 | Drive transmission device including a detection device and a protection member made of a conductive material | Toshiyuki Uchida, Narumi Sugita | 2014-04-01 |
| 8673744 | Wiring substrate, manufacturing method thereof, and semiconductor package | Junichi Nakamura | 2014-03-18 |
| 8539668 | Apparatus for manufacturing temporary substrate | Takeshi Okada | 2013-09-24 |
| 8525356 | Wiring substrate, manufacturing method thereof, and semiconductor package | Junichi Nakamura | 2013-09-03 |
| 8522988 | Jib stowing device for jib crane vehicle | Kenji Tanaka, Toshiaki Arakawa | 2013-09-03 |
| 8476536 | Wiring substrate and method for manufacturing the same | Kentaro Kaneko, Kotaro Kodani, Junichi Nakamura | 2013-07-02 |
| 8474807 | Conveying device, spine forming device, and image forming system | Shinji Asami, Nobuyoshi Suzuki, Naohiro Kikkawa, Tomohiro Furuhashi, Kiichiroh Gotoh | 2013-07-02 |
| 8399779 | Wiring board and method of manufacturing the same | Michiro Ogawa, Kentaro Kaneko | 2013-03-19 |
| 8383220 | Acrylic rubber | Takashi Kawasaki, Tsutomu Kobari, Daisuke Shimiya, Shogo Hagiwara | 2013-02-26 |