Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12084599 | Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation material | Emi MIYAZAWA, Tsuyoshi Hayasaka, Takashi Kawamori, Yoshihito Inaba, Keisuke NISHIDO | 2024-09-10 |
| 11840648 | Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation material | Emi MIYAZAWA, Tsuyoshi Hayasaka, Takashi Kawamori, Yoshihito Inaba, Keisuke NISHIDO | 2023-12-12 |