Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12084599 | Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation material | Emi MIYAZAWA, Tsuyoshi Hayasaka, Takashi Kawamori, Shinichiro Sukata, Yoshihito Inaba | 2024-09-10 |
| 11840648 | Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation material | Emi MIYAZAWA, Tsuyoshi Hayasaka, Takashi Kawamori, Shinichiro Sukata, Yoshihito Inaba | 2023-12-12 |