Tetsu Toda — 14 Patents at Renesas Electronics

Tetsu Toda has been granted 14 US patents while listed as an inventor at Renesas Electronics. The first was granted in 2003 and the most recent in August 2019. Tetsu Toda ranks #332,869 of 4,157,543 US inventors in our database (top 8.0%). Patent records list Tetsu Toda in Yokohama, JP.

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
10396547	Semiconductor device and power control device	Ryo Kanda, Hiroshi Kuroiwa, Yasushi Nakahara	2019-08-27
10224921	Semiconductor device and electric power control apparatus	Ryo Kanda, Koichi Yamazaki, Hiroshi Kuroiwa, Masatoshi Maeda	2019-03-05
10008561	Semiconductor device	Yoshinori Kaya, Yasushi Nakahara, Ryo Kanda	2018-06-26
10008919	Semiconductor device	Yoshinori Kaya, Yasushi Nakahara, Azuma Araya, Ryo Kanda, Tomonobu Kurihara	2018-06-26
9866207	Semiconductor device, power control device and electronic system	Ryo Kanda, Junichi Nakamura, Kazuyuki Umezu, Tomonobu Kurihara, Takahiro Nagatsu +2 more	2018-01-09
9621151	Semiconductor device and electric power control apparatus	Ryo Kanda, Koichi Yamazaki, Hiroshi Kuroiwa, Masatoshi Maeda	2017-04-11
9559687	Semiconductor device, power control device and electronic system	Ryo Kanda, Junichi Nakamura, Kazuyuki Umezu, Tomonobu Kurihara, Takahiro Nagatsu +2 more	2017-01-31
9343453	Semiconductor device	Ryo Kanda, Yasushi Nakahara, Yoshinori Kaya	2016-05-17
9324862	Semiconductor device	Yoshinori Kaya, Yasushi Nakahara, Ryo Kanda	2016-04-26
9287256	Semiconductor device including a separation region formed around a first circuit region	Yoshinori Kaya, Yasushi Nakahara, Azuma Araya, Ryo Kanda, Tomonobu Kurihara	2016-03-15
9048213	Semiconductor device	Ryo Kanda, Yasushi Nakahara, Yoshinori Kaya	2015-06-02
7710189	Semiconductor device for RF switching	—	2010-05-04
6784545	Semiconductor device having pad electrode connected to wire	Toshimichi Kurihara, Takahiro Kawabata, Shigeki Tsubaki	2004-08-31	$41,000
6507112	Semiconductor device with an improved bonding pad structure and method of bonding bonding wires to bonding pads	Toshimichi Kurihara, Shigeki Tsubaki	2003-01-14	$10,000

Tetsu Toda — 14 Patents

Issued Patents All Time

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