Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354952 | Integrated circuits (ICs) employing multi-pattern metallization to optimize metal interconnect spacing for improved performance and related fabrication methods | Bed Raj Kandel, Thomas Hua-Min Williams | 2025-07-08 |