Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354952 | Integrated circuits (ICs) employing multi-pattern metallization to optimize metal interconnect spacing for improved performance and related fabrication methods | Katherine Zhang, Thomas Hua-Min Williams | 2025-07-08 |
| 11658250 | Metal-oxide semiconductor (MOS) capacitor (MOSCAP) circuits and MOS device array bulk tie cells for increasing MOS device array density | — | 2023-05-23 |