Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777524 | Using an interconnect bump to traverse through a passivation layer of a semiconductor die | Thomas Scott Morris | 2020-09-15 |
| 9698137 | Electrostatic discharge (ESD) protection of capacitors using lateral surface Schottky diodes | Peter J. Zampardi, Jr., Brian G. Moser, Venkata B. Chivukula | 2017-07-04 |