Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996384 | Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications | Vahid Akhavan Attar | 2024-05-28 |
| 11358381 | Method for attaching and detaching substrates during integrated circuit manufacturing | Kurt A. Schroder, Vahid Akhavan Attar, Sze-Ming Lee | 2022-06-14 |