Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996384 | Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications | Vikram Shreeshail Turkani | 2024-05-28 |
| 11358381 | Method for attaching and detaching substrates during integrated circuit manufacturing | Kurt A. Schroder, Vikram Shreeshail Turkani, Sze-Ming Lee | 2022-06-14 |
| 11317517 | Method for connecting surface-mount electronic components to a circuit board | Rudresh Ghosh, John Michael Passiak, Kurt A. Schroder | 2022-04-26 |