LD

Lambert Devoe

PC Presidio Components.: 8 patents #3 of 5Top 60%
📍 San Diego, CA: #460 of 23,606 inventorsTop 2%
🗺 California: #4,893 of 386,348 inventorsTop 2%
Overall (All Time): #32,762 of 4,157,543Top 1%
66
Patents All Time

Issued Patents All Time

Showing 51–66 of 66 patents

Patent #TitleCo-InventorsDate
6969647 Method of making single layer capacitor Alan Devoe, Hung Van Trinh 2005-11-29
6970341 Integrated broadband ceramic capacitor array Daniel Devoe, Alan Devoe 2005-11-29
6917509 Single layer capacitor with dissimilar metallizations Daniel Devoe, Alan Devoe 2005-07-12
6885539 Single layer capacitor Alan Devoe, Hung Van Trinh 2005-04-26
6831529 Feed-through filter capacitor assembly Alan Devoe 2004-12-14
6831824 Surface mountable vertical multi-layer capacitor Alan Devoe 2004-12-14
6822847 Single layer capacitor Alan Devoe, Hung Van Trinh 2004-11-23
6816356 Integrated broadband ceramic capacitor array Daniel Devoe, Alan Devoe 2004-11-09
6753218 CERAMIC CHIP CAPACITOR OF CONVENTIONAL VOLUME AND EXTERNAL FORM HAVING INCREASED CAPACITANCE FROM USE OF CLOSELY SPACED INTERIOR CONDUCTIVE PLANES RELIABLY CONNECTING TO POSITIONALLY TOLERANT EXTERIOR PADS THROUGH MULTIPLE REDUNDANT VIAS Daniel Devoe, Alan Devoe, Hung Van Trinh 2004-06-22
6751082 CERAMIC CHIP CAPACITOR OF CONVENTIONAL VOLUME AND EXTERNAL FORM HAVING INCREASED CAPACITANCE FROM USE OF CLOSELY SPACED INTERIOR CONDUCTIVE PLANES RELIABLY CONNECTING TO POSITIONALLY TOLERANT EXTERIOR PADS THROUGH MULTIPLE REDUNDANT VIAS Daniel Devoe, Alan Devoe, Hung Van Trinh 2004-06-15
6661639 Single layer capacitor Alan Devoe, Hung Van Trinh 2003-12-09
6587327 Integrated broadband ceramic capacitor array Daniel Devoe, Alan Devoe 2003-07-01
6542352 CERAMIC CHIP CAPACITOR OF CONVENTIONAL VOLUME AND EXTERNAL FORM HAVING INCREASED CAPACITANCE FROM USE OF CLOSELY SPACED INTERIOR CONDUCTIVE PLANES RELIABLY CONNECTING TO POSITIONALLY TOLERANT EXTERIOR PADS THROUGH MULTIPLE REDUNDANT VIAS Daniel Devoe, Alan Devoe, Hung Van Trinh 2003-04-01
6366443 CERAMIC CHIP CAPACITOR OF CONVENTIONAL VOLUME AND EXTERNAL FORM HAVING INCREASED CAPACITANCE FROM USE OF CLOSELY-SPACED INTERIOR CONDUCTIVE PLANES RELIABLY CONNECTING TO POSITIONALLY-TOLERANT EXTERIOR PADS THROUGH MULTIPLE REDUNDANT VIAS Daniel Devoe, Alan Devoe 2002-04-02
6011684 Monolithic integrated multiple electronic components internally interconnected and externally connected by conductive side castellations to the monolith that are of varying width particularly monolithic multiple capacitors Alan Devoe 2000-01-04
5572594 Ear canal device holder Seth D. Silverstein, Robert Hershenfeld, Alan Devoe 1996-11-05