Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8289675 | Stacked multilayer capacitor | Alan Devoe, Lambert Devoe | 2012-10-16 |
| 7633739 | Stacked multilayer capacitor | — | 2009-12-15 |
| 7307829 | Integrated broadband ceramic capacitor array | Alan Devoe, Lambert Devoe | 2007-12-11 |
| 7075776 | Integrated broadband ceramic capacitor array | Alan Devoe, Lambert Devoe | 2006-07-11 |
| 7035080 | Combined multilayer and single-layer capacitor for wirebonding | Lambert Devoe, Alan Devoe | 2006-04-25 |
| 6970341 | Integrated broadband ceramic capacitor array | Alan Devoe, Lambert Devoe | 2005-11-29 |
| 6917509 | Single layer capacitor with dissimilar metallizations | Lambert Devoe, Alan Devoe | 2005-07-12 |
| 6816356 | Integrated broadband ceramic capacitor array | Alan Devoe, Lambert Devoe | 2004-11-09 |
| 6760215 | Capacitor with high voltage breakdown threshold | — | 2004-07-06 |
| 6753218 | CERAMIC CHIP CAPACITOR OF CONVENTIONAL VOLUME AND EXTERNAL FORM HAVING INCREASED CAPACITANCE FROM USE OF CLOSELY SPACED INTERIOR CONDUCTIVE PLANES RELIABLY CONNECTING TO POSITIONALLY TOLERANT EXTERIOR PADS THROUGH MULTIPLE REDUNDANT VIAS | Alan Devoe, Lambert Devoe, Hung Van Trinh | 2004-06-22 |
| 6751082 | CERAMIC CHIP CAPACITOR OF CONVENTIONAL VOLUME AND EXTERNAL FORM HAVING INCREASED CAPACITANCE FROM USE OF CLOSELY SPACED INTERIOR CONDUCTIVE PLANES RELIABLY CONNECTING TO POSITIONALLY TOLERANT EXTERIOR PADS THROUGH MULTIPLE REDUNDANT VIAS | Alan Devoe, Lambert Devoe, Hung Van Trinh | 2004-06-15 |
| 6690558 | Power resistor and method for making | Alan Devoe | 2004-02-10 |
| 6619763 | Feed-through filter capacitor with non-overlapping electrodes | Hung Van Trinh | 2003-09-16 |
| 6587327 | Integrated broadband ceramic capacitor array | Alan Devoe, Lambert Devoe | 2003-07-01 |
| 6545854 | Fringe-field non-overlapping-electrodes discoidal feed-through ceramic filter capacitor with high breakdown voltage | Hung Van Trinh | 2003-04-08 |
| 6542352 | CERAMIC CHIP CAPACITOR OF CONVENTIONAL VOLUME AND EXTERNAL FORM HAVING INCREASED CAPACITANCE FROM USE OF CLOSELY SPACED INTERIOR CONDUCTIVE PLANES RELIABLY CONNECTING TO POSITIONALLY TOLERANT EXTERIOR PADS THROUGH MULTIPLE REDUNDANT VIAS | Alan Devoe, Lambert Devoe, Hung Van Trinh | 2003-04-01 |
| 6366443 | CERAMIC CHIP CAPACITOR OF CONVENTIONAL VOLUME AND EXTERNAL FORM HAVING INCREASED CAPACITANCE FROM USE OF CLOSELY-SPACED INTERIOR CONDUCTIVE PLANES RELIABLY CONNECTING TO POSITIONALLY-TOLERANT EXTERIOR PADS THROUGH MULTIPLE REDUNDANT VIAS | Alan Devoe, Lambert Devoe | 2002-04-02 |
| 6081416 | Lead frames for mounting ceramic electronic parts, particularly ceramic capacitors, where the coefficient of thermal expansion of the lead frame is less than that of the ceramic | Hung Van Trinh, Alan Devoe | 2000-06-27 |
| 5740010 | Printing and adhering patterned metal on laid-up multi-layer green wafer before firing so as to later form precise integral co-fired conductive traces and pads on top and bottom surfaces of monolithic, buried-substrate, capacitors | Alan Devoe | 1998-04-14 |
| 5657199 | Close physical mounting of leaded amplifier/receivers to through holes in monolithic, buried-substrate, multiple capacitors simultaneous with electrical connection to dual capacitors otherwise transpiring, particularly for hearing aid filters | Alan Devoe | 1997-08-12 |
| 5625528 | Monolithic, buried-substrate, ceramic multiple capacitors isolated, one to the next, by dual-dielectric-constant, three-layer-laminate isolation layers | Alan Devoe | 1997-04-29 |
| 5367430 | Monolithic multiple capacitor | Alan Devoe | 1994-11-22 |