Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347800 | Method of fabricating a conductive layer on an IC using non-lithographic fabrication techniques | Richard Price | 2025-07-01 |
| 12199026 | Flexible interposer | Brian COBB, Scott White, Anthony SOU, Catherine Ramsdale, Rob MANN +5 more | 2025-01-14 |
| 7948060 | Integrated circuit structure | Michael David May, Simon Christopher Dequin Clemow | 2011-05-24 |