Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7619305 | Semiconductor package-on-package (POP) device avoiding crack at solder joints of micro contacts during package stacking | Wen-Jeng Fan, Li-Chih Fang | 2009-11-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7619305 | Semiconductor package-on-package (POP) device avoiding crack at solder joints of micro contacts during package stacking | Wen-Jeng Fan, Li-Chih Fang | 2009-11-17 |