Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7633160 | Window-type semiconductor package to avoid peeling at moldflow entrance | Chao-Hsiang Leu, Tseng-Shin Chiu | 2009-12-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7633160 | Window-type semiconductor package to avoid peeling at moldflow entrance | Chao-Hsiang Leu, Tseng-Shin Chiu | 2009-12-15 |