Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7633160 | Window-type semiconductor package to avoid peeling at moldflow entrance | Chuang-Fa Lee, Tseng-Shin Chiu | 2009-12-15 |
| 7408245 | IC package encapsulating a chip under asymmetric single-side leads | Chia-Yu Hung, Tseng-Shin Chiu | 2008-08-05 |