RP

Ronald D. Pinker

PA Philips Electronics North America: 11 patents #19 of 725Top 3%
NP North American Philips: 2 patents #168 of 645Top 30%
Philips: 1 patents #3,761 of 7,731Top 50%
📍 Peekskill, NY: #48 of 232 inventorsTop 25%
🗺 New York: #10,487 of 115,490 inventorsTop 10%
Overall (All Time): #356,717 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #TitleCo-InventorsDate
6473149 Elimination of the reverse-tilt in high-density reflective LCDs George Melnik, Robert H. Kane, Gerard Cnossen 2002-10-29
6348959 Reflective LCD with dark borders George A. Melnick 2002-02-19
5965976 Gas discharge lamps fabricated by micromachined transparent substrates Babar A. Khan, David A. Cammack, Jerry Kramer, Vivek Mehrotra 1999-10-12
5955838 Gas discharge lamps and lasers fabricated by micromachining methodology Babar A. Khan, David A. Cammack 1999-09-21
5919070 Vacuum microelectronic device and methodology for fabricating same Babar A. Khan, David A. Cammack 1999-07-06
5811935 Discharge lamp with T-shaped electrodes Thomas McGee, David A. Cammack, Babar A. Khan 1998-09-22
5808410 Flat panel light source for liquid crystal displays Peter Janssen, Babar A. Khan, David A. Cammack 1998-09-15
5796209 Gas discharge lamps and lasers fabricated by michromachining Babar A. Khan, David A. Cammack, Nikhil R. Taskar 1998-08-18
5624293 Gas discharge lamps and lasers fabricated by micromachining methodology Babar A. Khan, David A. Cammack, Nikhil R. Taskar 1997-04-29
5598052 Vacuum microelectronic device and methodology for fabricating same Babar A. Khan, David A. Cammack 1997-01-28
5574327 Microlamp incorporating light collection and display functions David A. Cammack, Babar A. Khan 1996-11-12
5438343 Gas discharge displays and methodology for fabricating same by micromachining technology Babar A. Khan, David A. Cammack, Jerry Kramer 1995-08-01
5261999 Process for making strain-compensated bonded silicon-on-insulator material free of dislocations Emil Arnold, Helmut Baumgart 1993-11-16
5213986 Process for making thin film silicon-on-insulator wafers employing wafer bonding and wafer thinning Steven L. Merchant 1993-05-25