Lid for a microelectronic package

Assignee

• IBM

Inventors

• John V. Acciaioli (5 patents)
• Myra Muth Boenke (2 patents)
• Larry D. Gross (5 patents)
• Martin Jay Marotti (99 patents)
• John B. Pavelka (19 patents)
• Roland Zapfe (34 patents)

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