Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › TSV compatible fiber array coupler for silicon photonics

TSV compatible fiber array coupler for silicon photonics

US Patent 9995881 · Granted Jun 12, 2018

Estimated economic value: $53,071,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Cold-formed laminates2025
Heatsinking in laser devices2025
Opto-electrical flexible glass interposer2024
Cold-formed laminates2024
Reinforced removable pluggable module pull tabs2024
Optical modulator using monocrystalline and polycrystalline silicon2024
Electro-optical modulator using waveguides with overlapping ridges2024
Integrated decoupling capacitors2023
Photonics packaging platform2023
Evanescent coupling of photodiode with optical waveguide2023
III-V laser platforms on silicon with through silicon vias by wafer scale bondin2023
Single-facet, variable-confinement optical waveguide amplifier2023