Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › III-V laser platforms on silicon with through silicon vias by wafer scale bonding

III-V laser platforms on silicon with through silicon vias by wafer scale bonding

US Patent 11728616 · Granted Aug 15, 2023

Estimated economic value: $40,597,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Non-resonant grating based multi-mode multi-pass tunable waveguide2025
Dual lens optical coupling to multicore fiber2025
Wavelength division multiplexing architecture based on integrated bragg and adia2025
Optical data converter2025
Heatsinking in laser devices2025
Laserless optical transceiver2025
Pluggable optical modules with blind mate optical connectors2024
Opto-electrical flexible glass interposer2024
Solder reflow compatible connections between optical components2024
Package self-heating using multi-channel laser2024
Thermal isolation element2024
Laserless optical transceiver2024