Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for assembling a microelectronic chip element on a wire element, and installation enabling assembly to be performed

Method for assembling a microelectronic chip element on a wire element, and installation enabling assembly to be performed

US Patent 9953953 · Granted Apr 24, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Sealing cell and method for encapsulating a microelectronic component with such 2020
Assembly for housing wire elements2020
Incorporation of chip elements in a core yarn2020
Method for assembling a microelectronic chip device in a fabric, chip device, an2019
Cap for a chip device having a groove, device provided with said cap, assembly c2018
Process for manufacturing an electrically conductive member for an electronic co2017
Method for assembling a chip in a flexible substrate2015
Photovoltaic cell, method for assembling plurality of cells and assembly of a pl2015
Method for assembling at least one chip using a fabric, and fabric including a c2015
Stacked electronic device and method of making such an electronic device2014
Inclusion of chip elements in a sheathed wire2014
Apparatus for assembling chip devices on wires2014