Issued Patents All Time
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763468 | Sealing cell and method for encapsulating a microelectronic component with such a sealing cell | Messaoud Bedjaoui, Johnny Amiran | 2020-09-01 |
| 10707363 | Assembly for housing wire elements | Dominique Vicard, Pierre Perichon | 2020-07-07 |
| 10640892 | Incorporation of chip elements in a core yarn | — | 2020-05-05 |
| 10264682 | Method for assembling a microelectronic chip device in a fabric, chip device, and fabric incorporating a crimped chip device | Delphine Christophe, Lionel Tenchine | 2019-04-16 |
| 9953953 | Method for assembling a microelectronic chip element on a wire element, and installation enabling assembly to be performed | — | 2018-04-24 |
| 9888573 | Cap for a chip device having a groove, device provided with said cap, assembly consisting of the device and a wire element, and manufacturing method thereof | Dominique Vicard | 2018-02-06 |
| 9743517 | Process for manufacturing an electrically conductive member for an electronic component comprising an end equipped with a cavity | Abdelhak Hassaine, Jean-Marie Quemper, Régis Taillefer | 2017-08-22 |
| 9179586 | Method for assembling a chip in a flexible substrate | — | 2015-11-03 |
| 9112079 | Photovoltaic cell, method for assembling plurality of cells and assembly of a plurality of photovoltaic cells | Dominique Vicard, Pierre Perichon | 2015-08-18 |
| 9093289 | Method for assembling at least one chip using a fabric, and fabric including a chip device | Dominique Vicard | 2015-07-28 |
| 8860200 | Stacked electronic device and method of making such an electronic device | — | 2014-10-14 |
| 8814054 | Inclusion of chip elements in a sheathed wire | Laurent Lancon, Dominique Vicard | 2014-08-26 |
| 8782880 | Apparatus for assembling chip devices on wires | Dominique Vicard | 2014-07-22 |
| 8723312 | Assembly of a wire element with a microelectronic chip with a groove comprising at least one bump securing the wire element | Dominique Vicard, Sophie Verrun | 2014-05-13 |
| 8654540 | Method for assembling at least one chip with a wire element, electronic chip with a deformable link element, fabrication method of a plurality of chips, and assembly of at least one chip with a wire element | Dominique Vicard | 2014-02-18 |
| 8611101 | Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly | Sophie Verrun, Dominique Vicard | 2013-12-17 |
| 8471773 | Assembly of radiofrequency chips | Dominique Vicard, Benoît Lepine | 2013-06-25 |
| 8445328 | Method for producing chip elements equipped with wire insertion grooves | Régis Taillefer | 2013-05-21 |
| 8435796 | Use of a fabric comprising a specific material for detecting the presence of a chemical substance | Catherine Durand, Alain Soubie | 2013-05-07 |
| 8258011 | Method for producing a set of chips mechanically interconnected by means of a flexible connection | Bruno Mourey, Dominique Vicard | 2012-09-04 |
| 8258044 | Method for fabricating chip elements provided with wire insertion grooves | Dominique Vicard | 2012-09-04 |
| 8112882 | Method for producing a structure | Xavier Baillin, Thierry Enot, David Henry | 2012-02-14 |
| 8093617 | Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructure | Dominique Vicard, Bruno Mourey | 2012-01-10 |
| 8012795 | Method and device for fabricating an assembly of at least two microelectronic chips | Benoît Lepine, Bruno Mourey, Dominique Vicard | 2011-09-06 |
| 7563703 | Microelectronic interconnect device comprising localised conductive pins | Remi Franiatte, Christiane Puget | 2009-07-21 |