Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8723312 | Assembly of a wire element with a microelectronic chip with a groove comprising at least one bump securing the wire element | Jean Brun, Dominique Vicard | 2014-05-13 |
| 8611101 | Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly | Jean Brun, Dominique Vicard | 2013-12-17 |
| 8039306 | 3D integration of vertical components in reconstituted substrates | Francois Baleras, Jean-Charles Souriau, Gilles Poupon | 2011-10-18 |