Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for manufacturing a handle substrate for the temporary bonding of a substrate

Method for manufacturing a handle substrate for the temporary bonding of a substrate

US Patent 9934995 · Granted Apr 3, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for transferring a layer from a source substrate to a destination substra2025
Process for hydrophilically bonding substrates2025
Method for transferring a layer from a source substrate to a destination substra2025
Semiconductor device and method for manufacturing a semiconductor device2025
Method for forming patterns on a substrate2025
Surface activated bonding method by ion or atom bombardment of a first surface o2025
Substrate structuring method2025
Method of treatment of an electronic circuit for a hybrid molecular bonding2023
Method for manufacturing a handle substrate intended for temporary bonding of a 2023
Method for manufacturing a handle substrate intended for temporary bonding of a 2023
Method for transferring chips2023
Method for fabricating a detection device comprising a step of direct bonding of2023