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Home › Microelectromechanical system (MEMS) bond release structure and method of wafer transfer for three-dimensional integrated circuit (3D IC) integration

Microelectromechanical system (MEMS) bond release structure and method of wafer transfer for three-dimensional integrated circuit (3D IC) integration

US Patent 9922956 · Granted Mar 20, 2018

Estimated economic value: $11,176,000 ⓘ

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