{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Signal via positioning in a multi-layer circuit board", "item": "https://www.patentleaderboard.com/patent/9916410"}]}

Home › Signal via positioning in a multi-layer circuit board

Signal via positioning in a multi-layer circuit board

US Patent 9916410 · Granted Mar 13, 2018

Estimated economic value: $2,527,000 ⓘ

Assignee

IBM

Inventors

Sungjun Chun (39 patents)
Matteo Cocchini (49 patents)
Michael A. Cracraft (37 patents)

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