Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wiring board including multiple wiring layers that are different in surface roughness

Wiring board including multiple wiring layers that are different in surface roughness

US Patent 9911695 · Granted Mar 6, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Multilayer ceramic electronic component, method of manufacturing the same, and c2025
Wiring board and wiring board manufacturing method2025
Resist layer forming method, method for manufacturing wiring board, and resist l2023
Wiring substrate and semiconductor package2019
Wiring board2017
Method for forming resist pattern, method for producing circuit board, and circu2012
Circuit board manufacturing method and circuit board2010
Method of forming metal plate pattern and circuit board2008
Process for making circuit board or lead frame2006