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Home › Process for making semiconductor dies, chips, and wafers using non-contact measurements obtained from DOEs of NCEM-enabled fill cells on test wafers that include multiple means/steps for enabling NC detection of V0 via opens

Process for making semiconductor dies, chips, and wafers using non-contact measurements obtained from DOEs of NCEM-enabled fill cells on test wafers that include multiple means/steps for enabling NC detection of V0 via opens

US Patent 9905487 · Granted Feb 27, 2018

Estimated economic value: $1,876,000 ⓘ

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