Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Top-side cooling of RF products in air cavity composite packages

Top-side cooling of RF products in air cavity composite packages

US Patent 9899292 · Granted Feb 20, 2018

Estimated economic value: $6,752,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic component with lid to manage radiation feedback2025
Package architecture utilizing wafer to wafer bonding2024
Electronic component with lid to manage radiation feedback2024
Integrated circuit die stacked with backer die including capacitors and thermal 2023
Package architecture utilizing wafer to wafer bonding2023
Packages for advanced antenna systems2022
Monolithic EML with electrically isolated electrodes2020
Monolithic EML with electrically isolated electrodes2020
Air cavity package2019
Method of fabricating a multi-channel modulator driver with enclosure2018
Method of fabricating a multi-channel modulator driver with enclosure2018
Apparatuses, systems, and methods for die attach coatings for semiconductor pack2017