Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectrics

Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectrics

US Patent 9893010 · Granted Feb 13, 2018

Estimated economic value: $3,124,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device including dummy conductive cells2024
Chip having a receiver including a hysteresis circuit2022
Three-dimensional integrated circuit having ESD protection circuit2021
Device-manufacturing scheme for increasing the density of metal patterns in inte2021
Device-manufacturing scheme for increasing the density of metal patterns in inte2021
Device-manufacturing scheme for increasing the density of metal patterns in inte2021
Device-manufacturing scheme for increasing the density of metal patterns in inte2021
Semiconductor device including dummy conductive cells2021
Additional spacer for self-aligned contact for only high voltage FinFETs2021
Over voltage/energy protection apparatus2021
Method of forming three-dimensional integrated circuit having ESD protection cir2021
Metal gate for a field effect transistor and method2020