Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Adaptable molded leadframe package and related method

Adaptable molded leadframe package and related method

US Patent 9892997 · Granted Feb 13, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package for III-nitride transistor stacked with diode2016
III-nitride device and FET in a package2016
III-nitride transistor stacked with diode in a package2015
III-nitride transistor stacked with FET in a package2014
Inverted circuit overcurrent protection device and hybrid integrated circuit dev2009
Semiconductor device and semiconductor module2007
Sheet-like board member and method of manufacturing a semiconductor device2007
Hybrid integrated circuit device2007
Half-bridge power module with insert molded heatsinks2006
Board for manufacturing a BGA and method of manufacturing semiconductor device u2006
Inverted circuit overcurrent protection device and hybrid integrated circuit dev2006
Circuit device and manufacturing method of circuit device2006